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  • 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011)
  • 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011)

    Type:

    Conference, Trade Show/Exhibition,

    Date:

    Mon, August 08, 2011 - Thu, August 11, 2011

    Location:

    Shanghai Riverfront Business Hotel, Shanghai , China

    Description:

    The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011) will be held in Shanghai, China, from August 08 to 11, 2011. The ICEPT-HDP 2011 is organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE) and co-organized by Shanghai University. The conference has received strong support from IEEE CPMT and active involvement from IMPAPS, ASME and iNEMI.

    ICEPT-HDP 2011 is a four-day event, featuring technical sessions, professional development courses/forums, exhibition, and social  networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.

    ICEPT-HDP 2011 Conference Themes:

    • Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SiP; TSV, 3D integration; and other advanced packaging and system integration technologies.
    • Packaging Materials & Processes: Green materials, nano-materials and other novel materials for packaging performance enhancement and cost reduction; and various new packaging/assembly processes.
    • Packaging Design and Modeling: New packaging/assembly designs; methodologies for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; multi-scale and multi-physics modeling.
    • High Density Substrate & SMT: Substrate with embedded passives and active components; HDI substrate, PCB, high performance multi-layer substrate; and various novel assembly technologies that improve substrate density and performance.
    • Advanced Manufacturing Technologies and Packaging Equipment: Packaging/assembly equipment; measurement techniques; novel packaging/assembly technologies for manufacturability and yield improvement.  
    • Quality & Reliability: Quality monitoring and evaluation; methodologies for accelerated reliability data collection and analysis, reliability modeling and life prediction; failure analysis and non-destructive diagnose.
    • Emerging Technologies: Sensors, actuators, MEMS, NEMS and MOEMS; optoelectronics packaging, CMOS image sensor packaging; packaging/integration technologies and their applications in LCD, passive & RF devices, power & HV devices, nano-devices, etc.
    • Solid State Lighting Packaging & Integration: CoB, WLP and other advanced packaging/integration technologies; methodologies for design, manufacturing and testing of high power LED module; LED packaging/integration technologies and their applications in LCD, micro-projector, in-door lighting, street lamp, etc.
  • [Close]  [Print] Time:2011-7-29
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